Sorts

Items

Processing capability in bulk

Model and processing small amount

Technology

Sorts of product

single/double plate board, multiply wood, high-frequency board, burie/blind plate

Mixed pressure of many material

Surface processing technology

Chemical termeric, immersion tin, electroplated gold over nickel, unlead solder levelling, immersion silver, osp, electroplated thick gold

Boards

Types of board

FR-4, CEM3, different εr high-frequency material (domestic, import), Rogers, metal plates (Al, Copper, iron), has no halogan FR-4

Thickness scope of boards

0.4mm-3.0mm

<0.4mm>&3.0mm

Allowence thickness ( t≥0.8mm)

±10%

±8%

Allowence thickness ( t ＜ 0.8mm)

±12%

±10%

Thickness of medium

0.075mm--6.00mm

0.05mm--0.075mm

Level

layers

1-8

10-16

Circuitry

Minimum line width

0.125mm

0.1mm

Minimum distance

0.125mm

0.1mm

Allowance of line spacing

≥ 10%

≤ 10%

Copper thickness

Copper thickness of lining and outer sphere

18mm-140mm(hoz-6oz)

18mm-140mm(hoz-6oz)

Hole diameter

Hole diameter of drill

≤ 0.30mm

≤ 0.2mm

Hole diameter of pore forming

≤ 0.2mm

0.00mm--0.10mm

Allowence of hole diameter

0.05mm

Allowence of hole site

0.075mm

0.050mm

Aperture ratio of board thickness

10:1

12:1;16:1

Green oil

Types of solder resist

Photosensitive ink

Minimum solder resist width

0.125mm

0.010mm

Minimum solder resist isolation ring

0.05mm

0.025mm

Size

Precision of outline size

±0.15m

±0.10mm

Maximum size

600mmX1200mm

1200mm-2000mm

Inpedance

Allowence of inpedance

±10%

±5%