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| TEL:86-0769-86717780 |
| FAX:86-0769-86717781 |
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PCB Process Flow
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Technical
discription:
Material:FR-4
Size:81.56*199.9mm
Finish:Immerion Gold with Gold Finger
1.0mm board thickness,0.5/0.5oz copper
Red solder mask and White legend |
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Technical
discription:
Materials：Teflon
Coefficient of dielectrical loss：2.55
Surface insulation resistance：≥1×104normal
Has the good electricity performance and the high mechanical strength,
suits the microwave transmission electronic products |
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Technical
discription:
Layer Coverage：4 Layers
thickness：1.2 mm
Surface Technique：Immersion Gold
Line Width/Space：4mils / 4mils
Solder Mask Color： Green
Specialty：Impedance Control |
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Technical
discription:
Material: FR4
Layer Coverage: 10L
Thickness: 2.0MM
Surface Technique: HAL Leadfree
Line Width/Space：4mils / 4mils
Solder Mask Color： Green
Specialty：Impedance Control
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| heavy copper audio boards |
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Technical
discription:
Material：FR-4
Size:405X330mm
Layer Coverage：4 Layers
thickness：2.0 mm
Surface Technique：ROHS HAL
Thickness of copper:2/2/2/2oz
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Technical
discription:
Material: FR-4
Layer Coverage: 2L
Thickness: 1.6MM
Surface Technique: Immersion Gold
Line Width/Space: 4mil/3mil
Solder Mask Color: Green |
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Technical
discription:
Material: FR-4
Layer Coverage: 4Layers
Thickness: 1.6mm
Surface Technique: Gold Plating
Line Width/Space: 8mil/8mil
Solder Mask Color: Green
Special: Gold Finger--Chamferring |
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| 10 layers of gush tin circuit board |
Technical
discription:
Material: FR-4
Layer Coverage: 10L
Thickness: 2.0MM
Thickness of copper:1oz
Surface Technique: Gush Tin
Solder Mask Color: Yellow |
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